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Online Measuring Instrument

According to the temperature, film thickness, curvature measurement module matching, the characteristic and parameters of each module 

 

Temperature measurement module

Technical feature:

 High precision, wide range, high consistency

 

 Strong anti-interference ability: can effectively suppress the interference due to temperature measurement of thin film interference effect ,can effectively suppress the temperature measurement error due to the installation position and The angle of deviation 

  

Temperature response rapidly, can realize the real-time control temperature

 

The software can real-time observe disk single point .multi-point temperature

Main parameters

Temperature measuring wavelength

940nm

Data sampling rate

30kHz

Temperature measuring precision

<0.5℃ @700°(blackbody furnace test)

Temperature measuring range

450℃-1300℃

Repeatablity

<1℃  ( T>500℃)

Aperture

5mm (150mm distance)(customized)

Distance from instrument light hole to measured  surface

<150mm

Graphite disk rotation speed

<1200rpm

Instrument working environment temperature

18℃ - 40℃

Working voltage

 

220VAC


Film thickness measuring module

Feature

 The two band selectable sensing chip reflectivity (940nm band and 635nm band)

Capable of simultaneously testing multiple point reflectance  comparison

 Real time calculation of film thickness growth rate

It can display the whole furnace wafer reflectivity Mapping value

Film thickness data through software can real-time observe disk single point.multipoint .

Parameters

Temperature measuring wavelength

635nm(20nm bandwidth) or 940nm

Data sampling rate

30kHz

Temperature measuring precision

<0.5℃ @700°(blackbody furnace test)

Aperture

5mm (150mm distance)(customized)

Distance from instrument light hole to measured  surface

<150mm

Graphite disk rotation speed

<1200rpm

Instrument working environment temperature

18℃ - 40℃

Working voltage

 

220VAC


Curvature measuring module

Feature:

Can real-time measure the wafer surface inclination

Can be calculated for each wafer warpageand the radius of curvature

Warp radius test range

>6m OR <-6m

Curvature test range

-150km-1 - 150km-1

Curvature resolution

1km-1

Data sampling rate

30kHz

Aperture

5mm (150mm distance)(customized)

Distance from instrument light hole to measured  surface

<150mm

Graphite disk rotation speed

<1200rpm

Instrument working environment temperature

18℃ - 40℃

Working voltage

 

220VAC



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